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THERMALLY CONDUCTIVE THERMOPLASTICS 

circuitboard

uDiamond® filler material enables the highest performing thermally conductive thermoplastics in electronic & LED applications.  Small additions of diamond are made in conjunction with boron nitride or alumina.  The nanoscale diamond with surface functional chemistry unlocks the potential of the compound for gains in thermal conductivity of 100% or more without compromising electrical or mechanical properties.  Typical diamond concentration 1%, additions as low as 0.03% in cost sensitive applications.

The performance improvement is driven by the high thermal conductivity of the diamond material at >2000W/mK, the small particle size and the active surface chemistry, resulting in seamless thermal conductivity between polymer, diamond material and other fillers.

Carbodeon is working extensively in thermoplastic compounds, but silicones and epoxides are also applicable materials for nanodiamond composites.

Currently, the preferred method of nanocomposite preparation would be to introduce uDiamond® as a liquid dispersion in a compatible solvent during polymer synthesis.

Where this is not possible, uDiamond® nanodiamond powder is pre-milled together with a micron scale thermal filler such as boron nitride or alumina. This will de-agglomerate the nanodiamond powder and distribute it over the surface of the micron scale filler particles. The resultant filler may then be compounded into the thermoplastic in the conventional way.

In published tests, Carbodeon has achieve the following:

Substitution of 0.03wt% uDiamond®* into a PA66-15% BN material: Increased Tc 25%

Substitution of 0.10wt% uDiamond®* into a PA66-15% BN material: Increased Tc 25-100%

Substitution of 1.50wt% uDiamond®* into a PA66-15% BN material: Increased Tc 130%

* For best results use our NEW uDiamond® grade uDiamond® Amine P

This is a very fast moving area and Carbodeon is launching new uDiamond® grades to support these applications, please contact us to discuss.